InP Wafer Specifications

Accessible view of the specifications
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Diameter (mm) Conduction range Dopand Etch Pit Density Growth method Data
100 SI (n-type) Fe ≤5000 VGF
Thickness Flat/Notch Polish Application

625

Flat

single

double

HBT

Detector

Solar

100 SC (n-type) S ≤500 VGF
Thickness Flat/Notch Polish Application

625

Flat

single

double

LED

LASER

Detector

100 SC (n-type) S ≤50 VGF
Thickness Flat/Notch Polish Application

625

Flat

single

double

LASER

Detector

3" SI (n-type) Fe ≤5000 VGF
Thickness Flat/Notch Polish Application

625

Flat

single

double

HBT

Detector

Solar

3" SC (n-type) S ≤500 VGF
Thickness Flat/Notch Polish Application

625

Flat

single

double

LASER

Detector

3" SC (n-type) S ≤50 VGF
Thickness Flat/Notch Polish Application

625

Flat

single

double

LASER

Detector

Standard Dimensions and Tolerances for 100 mm Diameter InP Wafers

Property Target Tolerance Units
Diameter 100 +/- 0.5 mm
Thickness, Center Point 625 +/- 25 µm
Primary Flat Length 32.5 +/- 2 mm
Secondary Flat Length 18 +/- 2 mm
Flat orientation (standard) US/EJ +/- 0.5 deg
Flat orientation (high precision) US/EJ +/- 0.02 deg
Surface orientation (standard) (100)* +/- 0.3 deg
Surface orientation (high precision) (100)* +/- 0.05 deg

* Off-orientation available

Standard Dimensions and Tolerances for 3" Diameter InP Wafers

Property Target Tolerance Units
Diameter 76.2 +/- 0.5 mm
Thickness, Center Point 625 +/- 25 µm
Primary Flat Length 22 +/- 2 mm
Secondary Flat Length 11 +/- 2 mm
Flat orientation (standard) US/EJ +/- 0.5 deg
Flat orientation (high precision) US/EJ +/- 0.02 deg
Surface orientation (standard) (100)* +/- 0.3 deg
Surface orientation (high precision) (100)* +/- 0.05 deg

* Off-orientation available

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